Led chip, led array and led packaging method

ABSTRACT

The disclosure relates to an LED chip, an LED array and an LED packaging method. By adding a reflecting layer on the periphery of the LED, the reflecting layer adjusts the emission direction of light emitted by a light-emitting layer of the LED, so that the adjusted emission direction is more concentrated to a certain required illumination direction, and the light emitted by the light-emitting layer is prevented from irradiating adjacent LEDs and thereby causing interference to the adjacent LEDs. Therefore, according to the method provided by the disclosure, the light field directivity of the emitted light beam is improved, the embodiment is easy to operate with convenient implementation and improved LED performance, providing convenience for a user to use an LED lamp.

TECHNICAL FIELD

The disclosure relates to the technical field of lighting equipment, inparticular to an LED chip, an LED, an LED array and an LED packagingmethod.

BACKGROUND

Light-emitting diode, which is called LED for short, is a kind ofsemiconductor component, and is a kind of lighting equipment whichconverts electric energy into light energy. The light-emitting diode ismanufactured by utilizing the principle that visible light can beradiated when electrons and holes are combined. LEDs may be used asindicator lights, or to compose numeric, alphabetic, or textualdisplays. For example, semiconductor materials are combined with otherelements to produce semiconductor layers for emitting green, blue, orwhite lights by using the semiconductor materials having high thermalstability and a wide band gap.

In general, light beams emitted by LEDs are uniformly emitted from theinterior of an LED chip. However, in order to avoid mutual interferenceof light beams emitted by a plurality of adjacent LEDs, the LEDs, asbacklight sources of a plurality of displays, often need better lightfield directivity. In the prior art, the light field directivity of theLEDs is usually achieved by luminance or current control of the LEDs.However, the current control of the LEDs often needs to be matched withthe design of a circuit board or a carrier board of which the structureis complex and the manufacturing process cost is high.

Accordingly, there remains a need in the art for improvements anddevelopments.

BRIEF SUMMARY

The disclosure is directed to solve the technical problems that aimingat the defects in the prior art, the disclosure provides an LED chip, anLED, an LED array and an LED packaging method for solving the problemsof poor light field directivity, divergent emitted lights, and lightinterference between adjacent LEDs caused by emitted light divergence inthe LED array in the prior art.

The technical scheme adopted by the disclosure for solving the technicalproblem is as follows:

In a first aspect, the present embodiment provides an LED chip, whichcomprises an LED chip body and a reflecting layer coated on a side edgesurface of the LED chip body.

Optionally, the LED chip body comprises a first semiconductor layer, asecond semiconductor layer disposed over the first semiconductor layer,and a light-emitting layer disposed between the first semiconductorlayer and the second semiconductor layer; the reflecting layer is coatedon a side edge surface of the second semiconductor layer.

Optionally, the first semiconductor layer is an N-type semiconductorlayer, the second semiconductor layer is a P-type semiconductor layer,and an N electrode is disposed on the N-type semiconductor layer; andthe reflecting layer is also coated on a side edge surface of the Nelectrode.

Optionally, one side edge surface of the N electrode is connected to oneside edge surface of the P-type semiconductor layer, and the P-typesemiconductor layer is coated on other side edge surfaces of the Nelectrode.

Optionally, a height of the reflecting layer is less than or equal to ½of a value of a distance between a top of the second semiconductor layerand a bottom of the first semiconductor layer.

Optionally, a side edge shape of the structure formed by the firstsemiconductor layer and the second semiconductor layer is trapezoid.

Optionally, a material of the first semiconductor layer is an N-typegallium nitride material, and a material of the second semiconductorlayer is a P-type gallium nitride material.

In a second aspect, the embodiment also discloses an LED, whichcomprises the LED chip described above.

In a third aspect, the embodiment also discloses an LED packagingmethod, which comprises covering an outer surface of the side edge ofthe second semiconductor layer of each LED by using the reflectinglayer.

In a fourth aspect, the embodiment also discloses an LED array, whichcomprises a circuit board and a plurality of the LEDs mounted on thecircuit board.

Optionally, a distance between any one of the LEDs and an adjacent LEDis inversely proportional to the height of the reflecting layer wrappedon the LED chip body.

Compared with the prior art, the embodiment of the disclosure has thefollowing advantages:

According to the LED chip, the LED, the LED array and the LED packagingmethod provided by the embodiment of the disclosure, by adding areflecting layer on the periphery of the LED chip body, the reflectinglayer can adjust the emission direction of light emitted by thelight-emitting layer of the LED chip, so that the adjusted emissiondirection is more concentrated to a certain required illuminationdirection, and the light emitted by the light-emitting layer isprevented from irradiating adjacent LEDs and thereby causinginterference to the adjacent LEDs. Therefore, according to the methodprovided by the disclosure, the light field directivity of the emittedlight beam is improved, the embodiment is easy to operate withconvenient implementation, providing convenience for improving LEDperformance.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a first side view of an LED chip in an embodiment of thepresent disclosure;

FIG. 2 is a second side view of an LED chip in an embodiment of thepresent disclosure;

FIG. 3 is a top view of an LED chip in an embodiment of the presentdisclosure;

FIG. 4 is a light path diagram of lights emitted from a light-emittinglayer in an LED chip according to an embodiment of the presentdisclosure;

FIG. 5 is a cross-sectional view of an LED chip in an embodiment of thepresent disclosure; and

FIG. 6 is a schematic diagram of the relationship between the distancebetween each LED in a LED array and the height of a reflecting layer inan embodiment of the present disclosure.

DETAILED DESCRIPTION OF EMBODIMENTS

In order that the objects, technical solutions, and advantages of thepresent disclosure will become more apparent and clear, the presentdisclosure will be described in further detail hereinafter withreference to the accompanying drawings and giving embodiments. It is tobe understood that the specific embodiments described herein are merelyillustrative of the present disclosure and are not intended to limit thepresent disclosure.

As LEDs in the prior art are commonly used as a light source of aninformation communication device besides common lighting equipment, whenthe LEDs are used, if the light beams emitted by the LEDs are toodivergent, the requirements of a user cannot be met when the user needsstrong illumination light in a certain direction, and the LEDs aregenerally used as lighting equipment in the form of an LED array or anLED lattice for providing the illumination function. If thelight-emitting directivity of each LED is weak, mutual interferencebetween each LED is serious, and high-quality light sources cannot beprovided. For example, if a backlight source with high luminance isrequired to be provided, each LED is required to have good light fielddirectivity, so that light beams emitted by each LED can point to thedirection of required illumination, and unnecessary light loss isavoided.

Embodiment 1

The embodiment provides an LED chip comprising an LED chip body and areflecting layer coated on a side edge surface of the LED chip body.

The LED chip body comprises a first semiconductor layer, a secondsemiconductor layer disposed over the first semiconductor layer, and alight-emitting layer disposed between the first semiconductor layer andthe second semiconductor layer.

The reflecting layer is coated on a side edge surface of the firstsemiconductor layer.

As shown in FIG. 1, the first semiconductor layer is an N-typesemiconductor layer 111, the second semiconductor layer is a P-typesemiconductor layer 112, and the both are connected to form a P-Nstructure. Light is emitted by injecting electrons into the P-N using anexternal power source. Disposed between the P-type semiconductor layer112 and the N-type semiconductor layer 111 is a light-emitting layer113, that is, an active layer, which is made of a doubleheterostructure. An N electrode 116 is disposed on the N-typesemiconductor layer 111; the reflecting layer 114 is also coated on anouter surface of the side edge of the N electrode 116.

A donor impurity is doped into the semiconductor material to obtain anN-type semiconductor layer, an acceptor impurity is doped into thesemiconductor material to obtain a P-type semiconductor layer, and theN-type semiconductor layer and the P-type semiconductor layer can forman unijunction semiconductor element, namely a light-emitting diode.

In a chip of an LED provided in this embodiment, the LED chip isconstructed by using the N-type semiconductor layer 111 and the P-typesemiconductor layer 112, the light-emitting layer 113 disposed betweenthe N-type semiconductor layer 111 and the P-type semiconductor layer112, the N electrode 116 disposed on the N-type semiconductor layer 111,and a P electrode 115 disposed on the P-type semiconductor layer 112.

Specifically, as shown in FIG. 1, the LED chip includes an N-typesemiconductor layer 111 over which a P-type semiconductor layer isdisposed. Since the LED chip provided in this embodiment is a flip chip,the LED chip disclosed in this embodiment has an inverted structure ofthe structure shown in FIG. 1 when packaged. An N electrode 116 isdisposed on the N-type semiconductor layer 111, a P electrode 115 isdisposed on the P-type semiconductor layer 112, a light-emitting layer113 is disposed between the N-type semiconductor layer 111 and theP-type semiconductor layer 112, and a light emitted by thelight-emitting layer 113 is emitted after being reflected.

In order to prevent a light beam emitted from the light-emitting layer113 from being emitted from an outer surface of the side edge of theP-type semiconductor layer 112, in this embodiment, a reflecting layer114 is disposed on the outer side surface of the P-type semiconductorlayer 112, so that the light beam emitted onto the inner wall of theP-type semiconductor layer 112, as shown with reference to FIG. 4,passes through the light-emitting layer 113 and the N-type semiconductorlayer 111 and is emitted to the lower surface of the LED. Thus, thelights emitted to the side edge is all reflected to have a same lightdirection, so that the light irradiated to the same direction isstrengthened, the intensity of lights irradiated to the same directionis increased, and interference to adjacent LEDs is avoided.

Specifically, with reference to FIGS. 2 and 3, one side edge surface ofthe N electrode 116 is connected to one side edge surface of the P-typesemiconductor layer 112, and the P-type semiconductor layer 112 iscoated on the periphery of the other side edge surfaces of the Nelectrode 116. As can be seen from FIG. 2, the P-type semiconductorlayer is disposed over the N-type semiconductor layer and surrounds theN electrode. With reference to FIG. 5, the P-type semiconductor layer112 surrounds three faces of the N electrode 116, and the reflectinglayer 114 covers the side edges of the P-type semiconductor layer 112and the N electrode 116, so that light beams emitted to the inner wallsof the side edge of the P-type semiconductor layer 112 or the Nelectrode 116 are emitted to a same plane by reflection of thereflecting layer 114.

In one example of this embodiment, a shape of the side edge composed ofthe N electrode 116, the P-type semiconductor layer 112, and the N-typesemiconductor layer 111 is designed to be trapezoidal. Since the shapeof the side edge composed of the N electrode 116, the P-typesemiconductor layer 112, and the N-type semiconductor layer 111 istrapezoidal, and the side edges of the N electrode 116 and the P typesemiconductor layer 112 are positioned on the upper half part of thetrapezoid, a light reflected by the reflecting layer 114 passes throughthe light-emitting layer 113 and the N type semiconductor layer 111 andthen is transmitted out of the lower surface of the trapezoid structure,so as to obtain a better light field directivity effect and a backlightsource with higher quality.

In another example of this embodiment, it is also possible to obtain abetter light reflection effect by designing a height of the reflectinglayer, which is less than or equal to ½ of a value of a distance betweenthe top of the P-type semiconductor layer 112 and the bottom of theN-type semiconductor layer 111, such that the emitting angle of the LEDis about 145 degrees. In a specific implementation, the minimum heightvalue of the reflecting layer 114 may be calculated based on an anglevalue between the side edge of the P-type semiconductor layer 112 andthe upper or lower surface of the P-type semiconductor layer 112, thelength value of the side edge of the P-type semiconductor layer 112, andthe length value of the light-emitting layer 113, so that the lightirradiated onto the reflecting layer can be reflected onto the lowersurface of the N-type semiconductor layer 111.

In a specific implementation, since a nitride semiconductor such as agallium nitride (GaN) semiconductor has high thermal stability and awide band gap, the material of the N-type semiconductor layer 111 may bean N-type gallium nitride material obtained by doping a donor impurityin the gallium nitride material, and the material of the P-typesemiconductor layer 112 may be a P-type gallium nitride materialobtained by doping an acceptor impurity in the gallium nitride material.The material of the reflecting layer can also be made of gallium nitridematerial.

Embodiment 2

The embodiment also discloses an LED, which comprises the LED chipdescribed above.

With reference to FIG. 4, the LED is disposed with the LED chipdisclosed in the embodiment 1, a substrate which is respectivelydisposed below the LED chip and connected with the LED chip, and acircuit board disposed below the substrate. The substrate is disposedwith an N electrode connector and a P electrode connector which arerespectively connected with the N electrode and the P electrode on theLED chip.

Due to the fact that a reflecting layer is disposed on the LED chip ofthe LED, a light emitted by the LED can be intensively emitted to thefront of the LED, so that the light field directivity of light beamsemitted by a single LED is increased, the light emitted by the LED iseasier to control, and the luminous intensity of the LED is improved. Onthe premise of the same luminance, more energy is saved.

Embodiment 3

In a third aspect, the embodiment also discloses an LED packagingmethod, which comprises covering an outer surface of the side edge ofthe second semiconductor layer of each LED by using a reflecting layer.

The embodiment of the disclosure also discloses a packaging method ofLED, wherein a reflecting layer is coated on the outer surface of theside edge of the second semiconductor layer, so that light beamsirradiated to the side edge of the second semiconductor layer areemitted to a given direction by reflection of the reflecting layer,thereby realizing regulation and control on the light emitted from theLED light-emitting layer.

The LED chip comprises a first semiconductor layer, a secondsemiconductor layer disposed on the first semiconductor layer, alight-emitting layer disposed between the first semiconductor layer andthe second semiconductor layer, and a reflecting layer coated on anouter side of a side edge of the first semiconductor layer. The firstsemiconductor layer is a P-type semiconductor layer, the secondsemiconductor layer is an N-type semiconductor layer, and the both areconnected to form a P-N junction. Light is emitted by injectingelectrons into the P-N using an external power source. Disposed betweenthe P-type semiconductor layer and the N-type semiconductor layer is alight-emitting layer. An N electrode is disposed on the N-typesemiconductor layer; and the reflecting layer is also coated on an outersurface of a side edge of the N electrode.

Specifically, when the LED is packaged, an N-type semiconductor layer isprovided with an N electrode, a P electrode is disposed for a P-typesemiconductor layer, the N electrode is connected to the N-typesemiconductor layer, and the P electrode is connected to the P-typesemiconductor layer.

A light-emitting layer is disposed on the N-type semiconductor layer,wherein the light-emitting layer covers a part of the upper surface ofthe N-type semiconductor layer without including the N electrode.

A P-type semiconductor layer is disposed on the light-emitting layer,the P-type semiconductor layer covers an outer side surface of the Nelectrode, and the reflecting layer covers an outer surface of theP-type semiconductor layer.

Specifically, the N electrode may also be disposed on one side of thelight-emitting layer parallel to one end plane of the light-emittinglayer, so that the P-type semiconductor layer only needs to be coveredon the other outer side surfaces of the N electrode at this time.

With reference to FIG. 5, for packaging the LED chip, the LED chip isconnected with a substrate and the like, and then packaged in an LEDlampshade to form the LED provided by the embodiment.

When the packaging is carried out, a ratio between the height value ofthe reflecting layer and the height value of the whole LED is requiredto be preset, and the reflecting layer extends from the P-typesemiconductor layer to the N electrode. The emitted light beam of theLED is emitted from the light-emitting layer inside the LED, and aforward light field is intensively emitted by the reflecting layer. Aheight h between the reflecting layer and the LED substrate is requiredto be calculated according to a height H of the LED in order to meet therequirement that the light emitted by the light-emitting layer isintensively emitted to a forward light field. With reference to FIG. 2,in order to achieve the above object, the height h of the reflectinglayer at a side edge is less than or equal to ½ of the height H of theLED such that the emitting angle of the LED is about 145 degrees. Thedifferent height of the reflecting layer can be respectively designedand the emission angle of the LED can be adjusted according torequirements of different light field directions.

Embodiment 4

On the basis that an LED is disclosed in the embodiment 2, theembodiment discloses an LED array, as shown in FIG. 6, comprising acircuit board and the LEDs described above mounted on the circuit board,as shown in FIG. 6, a first LED 601 and a second LED 602.

Due to the fact that the reflecting layer 114 is disposed on the LEDchip of the LED, the light emitted by the LED can be intensively emittedto the front of the LED; the light emitted by adjacent LEDs cannot beinterfered by the LED because no light is emitted from the side edge ofthe LED, so as to solve the problem that the interference is large dueto the fact that the distance between the adjacent LEDs is short.

In order to avoid the problem of light interference MURA between eachLED, it can be realized by two methods of increasing a distance betweentwo LEDs and increasing a height of the reflecting layer in each LEDchip; and in the embodiment, light interference between each LED isavoided by setting the distance between two adjacent LEDs and the heightof the reflecting layer in each LED chip. Since the smaller the distanceis between adjacent LEDs, the greater the interference is, in order toreduce the interference, in this embodiment the distance between any oneof the LEDs and an adjacent LED is arranged in an inversely proportionalrelationship to the height of the reflecting layer wrapped on the LEDchip body.

According to the LED array provided by the embodiment, the reflectinglayer for emitting light regulation is added to the LED chip in eachLED, so that the LEDs have higher light field directivity; and due tothe fact that each LED has better light field directivity, when aplurality of the LEDs are packaged into the LED array, the phenomena ofuneven display luminance and various traces of the LED array lightsource are reduced, and the luminance performance of the LED array isimproved.

According to the LED, the LED array and the LED packaging methodprovided by the embodiment of the disclosure, by adding a reflectinglayer on the periphery of the LED, the reflecting layer can adjust theemission direction of light emitted by the light-emitting layer of theLED, so that the adjusted emission direction is more concentrated to acertain required illumination direction, and the light emitted by thelight-emitting layer is prevented from irradiating adjacent LEDs andthereby causing interference to the adjacent LEDs. Therefore, accordingto the method provided by the disclosure, the light field directivity ofthe emitted light beam is improved, the embodiment is easy to operatewith convenient implementation, providing convenience for improving LEDperformance.

Other embodiments of the disclosure will be apparent to those skilled inthe art from consideration of the description and practice of thedisclosure disclosed herein. The present disclosure is intended to coverany variations, uses, or adaptations of the disclosure following thegeneral principles of the disclosure and including common generalknowledge or customary technical means in the art not disclosed in thisdisclosure. It is intended that the description and examples beconsidered as exemplary only, with a true scope and spirit of thedisclosure being indicated by the following claims.

It should be understood that the disclosure is not limited to theprecise constructions described above and shown in the drawings, andthat various modifications and changes may be made without departingfrom the scope thereof. The scope of the disclosure is limited only bythe accompanying claims.

1. An LED chip, wherein comprising an LED chip body and a reflectinglayer coated on a side edge surface of the LED chip body.
 2. The LEDchip according to claim 1, wherein the LED chip body comprises a firstsemiconductor layer, a second semiconductor layer disposed over thefirst semiconductor layer, and a light-emitting layer disposed betweenthe first semiconductor layer and the second semiconductor layer; thereflecting layer is coated on a side edge surface of the secondsemiconductor layer.
 3. The LED chip according to claim 2, wherein thefirst semiconductor layer is an N-type semiconductor layer, the secondsemiconductor layer is a P-type semiconductor layer, and an N electrodeis disposed on the N-type semiconductor layer; and the reflecting layeris coated on a side edge surface of the N electrode.
 4. The LED chipaccording to claim 3, wherein one side edge surface of the N electrodeis connected to one side edge surface of the P-type semiconductor layer,and the P-type semiconductor layer is coated on other side edge surfacesof the N electrode.
 5. The LED chip according to claim 1, wherein aheight of the reflecting layer is less than or equal to ½ of a value ofa distance between a top of the second semiconductor layer and a bottomof the first semiconductor layer.
 6. The LED chip according to claim 1,wherein a material of the first semiconductor layer is an N-type galliumnitride material, and a material of the second semiconductor layer is aP-type gallium nitride material.
 7. (canceled)
 8. An LED packagingmethod of an LED which comprises the LED chip according to claim 1,wherein comprising covering an outer surface of the side edge of thesecond semiconductor layer of each LED by using a reflecting layer. 9.An LED array, wherein comprising a circuit board and a plurality of LEDswhich comprise the LED chip according to claim 1 mounted on the circuitboard.
 10. The LED array according to claim 9, wherein a distancebetween any one of the LEDs and an adjacent LED is inverselyproportional to the height of the reflecting layer wrapped on the LEDchip body.
 11. The LED chip according to claim 3, wherein a height ofthe reflecting layer is less than or equal to ½ of a value of a distancebetween a top of the second semiconductor layer and a bottom of thefirst semiconductor layer.